Center for Innovative Integrated Electronic Systems, Tohoku University (Location: Sendai City, Miyagi Prefecture, Japan) (Director: Tetsuro Endo, “CIES”) and T&S inc. (Head office: Yokohama City, Kanagawa Prefecture, Japan) (President and CEO: Yoshihiro Takekawa) have started a joint research collaboration on next-generation memory control and application software.
Background
T&S inc.research and development aims to integrate AI and the next-generation semiconductor memory.
The next-generation of semiconductor memory currently being developed at CIES uses the world’s top-level technology. The power consumption of microcomputers and AI processors equipped with this memory is lower than that of conventional processors. It can reduce from 1/100 to 1/1000th of the original level without any loss of performance (Note 1,2,3).
In recent years, the rapid growth of fields such as automated driving, image processing, IoT devices and the robotics industry has been accompanied by extensive research on low power consumption.
The research results of CIES next generation memory and the chips based on it are expected to make a significant contribution to the development of the field.
Overview
(1)Research and development to ensure the reliability of next-generation semiconductor memory
Error bits may occur during data reading/writing in semiconductor memory (in digital recording
the bits that make up the data are damaged in the process of transmission and re-generation,
and the bits are inverted). Error correction to increase memory reliability is an essential
technology for the commercialization of next-generation semiconductor memory.
T&S inc. is developing error correction technology suitable for next-generation semiconductor
memory, aiming to provide hardware embedding technology with high reliability.
(2)Research and development of AI application software for next-generation semiconductor memory AI processors
AI processors installed in autonomous driving, industrial equipment, and IoT devices are
expected to consume less power and have a faster response, but at present they are still
in the development stage. By installing next-generation semiconductor memory with excellent
power consumption and response in the AI processor, it is possible to achieve further energy
savings, downsizing, and higher functionality than conventional equipment. T&S inc. designs
firmware and AI application software that take advantage of the characteristics and performance
of next-generation semiconductor memory in order to promote R&D and commercialization using
the next-generation AI processor equipped with next-generation semiconductor memory.
We are aiming to provide an environment where companies can proceed with development and
easily evaluate and develop using our AI application boards.
(Note 1) M. Natsui et al., ISSCC2019 (2019) (International Solid-State Circuits Conference) , Feb. 17-21, 2019, San Francisco.
(Note 2) T. Endoh, MMM2016 (61st Annual Conference on Magnetism and Magnetic Materials), Oct.31-Nov.4 , 2016, New Orleans.
(Note 3) T. Endoh, SEMICON China2017, Mar.14-16, 2017 , Shanghai.
(Added June 23, 2020)
An article related to this issue appeared on pages 28-45 of the June 2020 issue of Nikkei Electronics.
Please read it.
For more information, please contact the IR Planning and Public Relations Department at T&S inc.
E-Mail：pr@tecsvc.co.jp